Yashobhoomi in New Delhi turned into a major showcase of India’s expanding semiconductor capabilities as SEMICON India 2026 brought together technologies spanning chip design, advanced packaging, artificial intelligence, high-performance computing, materials and manufacturing.
Held from 17 to 19 September 2026, the fifth edition of SEMICON India was organised around the theme “Silicon to Systems: Building the Ecosystem.” The event brought together semiconductor companies, policymakers, investors, researchers, academia and start-ups, highlighting the growing depth of India’s semiconductor ambitions.
With more than 600 exhibiting companies from across the world, the exhibition featured a Start-up Pavilion, Workforce Development Pavilion, country and state pavilions, and a hackathon. Together, these platforms provided a broad view of India’s evolving semiconductor landscape.
From Chip Design to High-Performance Computing
A key attraction of the exhibition was the growing range of indigenous semiconductor and computing technologies.
The Centre for Development of Advanced Computing (C-DAC) showcased capabilities in high-performance computing and artificial intelligence, including the AUM HPC-AI Processor and RUDRA-AUM compute node. The technologies demonstrated the expanding focus on developing domestic capabilities across both semiconductor components and complete computing systems.
The exhibition also highlighted India’s growing interest in indigenous processor development. Domestic start-ups and research institutions are increasingly working on processors, application-specific integrated circuits and system solutions for areas such as telecommunications, automotive technologies, artificial intelligence and surveillance.
Indigenous Chips for Real-World Applications
SEMICON India 2026 also demonstrated how semiconductor innovation is increasingly moving from design laboratories into practical applications.
Companies and start-ups displayed technologies aimed at smart appliances, connectivity, industrial systems, surveillance, energy management and electric mobility.
Vervesemi Microelectronics, for instance, showcased semiconductor solutions for applications including motor control, energy meters and data acquisition. Its technologies cover areas such as consumer appliances, electric mobility and drones, underlining the role of application-specific chips in strengthening India’s electronics ecosystem.
RISC-V Strengthens India’s Processor Ambitions
Indigenous processor development emerged as another important area at the exhibition.
C-DAC showcased its 64-bit RISC-V processor, reflecting efforts to strengthen domestic expertise in processor architecture and advanced semiconductor technologies. Based on the open RISC-V architecture, the processor is designed for applications involving high-performance computing and emerging digital technologies.
InCore Semiconductors presented its work on indigenous RISC-V processor intellectual property and system-on-chip design automation tools. Its processor platforms address different computing requirements, including embedded and edge-AI applications. The company’s processor IP has reportedly been silicon-proven across multiple customer chips and technology nodes ranging from 180 nm to 16 nm.
Aheesa Technology showcased an indigenous internet connectivity solution capable of speeds of up to 1 Gbps. The system can enable Internet Service Providers to connect around 64 homes through a single Optical Line Terminal and uses the India-developed Vihan software platform alongside C-DAC’s 64-bit RISC-V processor.
AI and Smart Surveillance Drive New Applications
The convergence of semiconductor technology and artificial intelligence was another prominent theme.
Indian semiconductor start-up Netrasemi showcased AI-capable System-on-Chips designed for applications including smart surveillance, robotics, drones, mobility and intelligent sensors.
The company has taped out an indigenous AI SoC for CCTV surveillance using a 12 nm process node, integrating AI/ML accelerators, vision processing and video engines. Such technologies demonstrate how semiconductor advances are supporting increasingly intelligent edge applications.
Semicon 2.0 Expands the Strategic Vision
The exhibition reflected a semiconductor strategy extending beyond chip fabrication to the broader value chain, including equipment, materials, testing, packaging, research and talent.
This approach aligns with Semicon 2.0, approved by the Union Cabinet in July 2026 with an outlay of ₹1,27,500 crore. The programme focuses on six strategic areas: design, machines and materials, fabs, advanced packaging, research and development, and talent development.
Start-ups, Students and Chip Designers
The Start-up Pavilion highlighted the expanding role of emerging companies in India’s semiconductor ecosystem.
Government initiatives such as the Design Linked Incentive (DLI) Scheme have supported chip-design projects involving video surveillance, drone detection, energy meters, microprocessors, satellite communications, broadband and IoT systems.
The Chips to Startup (C2S) Programme is also expanding access to semiconductor design resources for students, researchers, institutions and start-ups.
More than one lakh engineers from over 500 organisations, including around 400 academic institutions and 100 start-ups, have reportedly been onboarded through the ChipIN Centre under the C2S Programme and DLI Scheme. Participants have access to advanced design tools, fabrication services and specialised training, while more than 300 chip designs have been developed for fabrication in India and overseas.
From Policy Support to Commercial Production
SEMICON India 2026 was held as India’s semiconductor ecosystem moves from policy and capability building towards manufacturing and commercial activity.
Under the Semicon India Programme, 12 semiconductor projects have been approved across six states, involving investment commitments of more than ₹1.64 lakh crore. Three facilities have already commenced commercial production.
The exhibition therefore offered a picture of an ecosystem that extends beyond future ambitions, with capabilities emerging across design, manufacturing, packaging, computing and supporting technologies.
Building an End-to-End Semiconductor Ecosystem
The theme “Silicon to Systems: Building the Ecosystem” reflected the widening scope of India’s semiconductor journey.
A competitive semiconductor ecosystem requires chip designers, fabrication facilities, advanced packaging and testing capabilities, equipment and materials suppliers, research institutions, start-ups, system companies and skilled professionals.
SEMICON India 2026 brought these interconnected elements together at Yashobhoomi, showcasing India’s expanding capabilities from RISC-V processors and AI-enabled SoCs to application-specific chips, advanced computing and semiconductor manufacturing.
The three-day exhibition provided a detailed snapshot of an ecosystem increasingly connecting indigenous innovation, industrial capacity and global semiconductor opportunities.
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