Home Science and Technology SEMICON India 2026: “Major Breakthrough” As 25 Deals Boost India’s Chip Ambitions

SEMICON India 2026: “Major Breakthrough” As 25 Deals Boost India’s Chip Ambitions

“Major Breakthrough” at SEMICON India 2026 as 25 strategic deals accelerate semiconductor manufacturing, chip design, advanced packaging, supply-chain localisation and workforce development in India.

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India’s semiconductor push gained further momentum on the second day of SEMICON India 2026, with 25 major announcements, memoranda of understanding and strategic collaborations covering critical areas of the semiconductor value chain. The partnerships span semiconductor manufacturing, advanced packaging, materials, logistics, chip design, power electronics, workforce development and deep-tech investment.

The three-day event, being held at Yashobhoomi in New Delhi, has attracted strong participation from the global semiconductor industry. Nearly 12,000 visitors attended the first day, with industry participants forming the majority. The exhibition features more than 600 companies, including around 300 international exhibitors.

Ashwini Vaishnaw Highlights Rising Global Interest

Addressing the media, Union Minister for Electronics and Information Technology Ashwini Vaishnaw said participation on the second day was even higher, with strong business-to-business engagement and several agreements being concluded through industry meetings.

He said the technical and business sessions were also receiving a positive response. Country roundtables involving Japan and Singapore attracted more than 30 companies each, while companies from South Korea and European nations, including Belgium, the Netherlands and Sweden, also participated.

According to Vaishnaw, the growing presence of international companies reflects increasing global interest in expanding semiconductor-related operations in India. He also pointed to investment interest emerging at the event, with industry leaders indicating their intention to scale up investments depending on their execution capabilities.

Major Push for Semiconductor Supply Chain

Strengthening India’s semiconductor supply chain remained a key focus on Day 2.

The India Semiconductor Mission and Nippon Express Holdings signed an MoU aimed at developing stronger semiconductor logistics infrastructure. Nippon Express will provide expertise in logistics, warehousing, customs and other supply-chain requirements as semiconductor manufacturing expands in India.

Several Tata Electronics partnerships also focused on building a stronger domestic supply ecosystem. Tata Electronics and INOX Air Products will work to strengthen local supplies of high-purity gases required for semiconductor manufacturing, while its partnership with Sumitomo Chemical will focus on localising high-purity wet chemicals and advanced materials used in front-end semiconductor production.

Tata Electronics also partnered with Kelington Engineering to support fab readiness through gas distribution systems, high-purity piping and process-tool hook-up, while the collaboration includes training for local partners in specialised semiconductor manufacturing skills.

Another Tata Electronics partnership with Enomoto will focus on advanced semiconductor packaging, including joint research and development and localisation of lead-frame manufacturing.

Power Electronics and Indigenous Technology Gain Momentum

The semiconductor announcements also extended into power electronics and strategic infrastructure.

C-MET Pune and Hindalco Industries signed an MoU to scale up critical raw materials for the semiconductor ecosystem, supporting indigenous material capabilities and supply-chain resilience.

India

MeitY, the Ministry of Power and POWERGRID announced a collaboration for indigenising Silicon Carbide power modules for Voltage Source Converter-based high-voltage direct-current transmission systems. The technology will be piloted at POWERGRID’s 1,000 MW Pusauli project in Bihar.

L&T Semiconductor Technologies announced multiple collaborations covering power electronics, renewable energy, smart metering and next-generation applications. These include partnerships for Silicon Carbide power modules, Insulated Gate Bipolar Transistors and indigenous 4G communication modules for smart meters.

Tata Electronics and L&T Semiconductor Technologies also announced a strategic partnership to explore manufacturing L&T semiconductor products at Tata’s fab and OSAT facilities, beginning with consumer-grade camera modules.

India Unveils Indigenous System-on-Module

A major technology highlight was the launch of IndieSemiC’s ISC-VEGA-SOM, described as India’s first indigenous System-on-Module. Developed under C-DAC’s Industry Support Centre initiative, the module integrates C-DAC’s VEGA Thejas32 processor with IndieSemiC’s globally certified LoRa-RF module.

Also Read — Semiconductor Boom in India: 5 Chip Plants Start Production as ISM 2.0 Tackles Major Gaps

The development demonstrates the growing ability of Indian semiconductor design companies to move from innovation towards commercial products. The government said the development reflects the country’s gradual transition towards becoming a product-oriented semiconductor ecosystem.

Kaynes Semicon and IndieSemiC also announced an OSAT collaboration covering qualification, assembly and testing of advanced QFN and BGA packages and customised System-in-Package development.

Semiconductor Skills and Deep-Tech Investment Expand

Workforce development featured prominently in the Day 2 announcements.

SEMI and India Deep Tech Alliance announced plans for the India Semiconductor Academy, an industry-led national skilling platform involving partners such as Cadence, CG Semi, Dixon Technologies, Micron Technology, Synopsys, 3D Glass Solutions, UC San Diego and IIT Kanpur.

The India Deep Tech Alliance also reported investments of $263 million across 56 Indian deep-tech companies.

NIELIT signed and announced several initiatives with Siemens EDA, Tata Electronics, Singapore Polytechnic International, SCL, IESA and SEMI University to strengthen semiconductor design education, ATMP workforce development, faculty training, certification and industry-ready skills.

NIELIT and SCL also launched an indigenous 0.8-micron open-source Process Design Kit on the NIELIT eChipHub platform, aimed at widening access to chip-design capabilities for students and innovators.

Focus on Sustainable Semiconductor Infrastructure

Sustainability was another important theme highlighted by the Minister. Vaishnaw pointed to extensive water recycling in semiconductor fabrication facilities and closed-loop cooling systems in data centres as examples of resource-efficient infrastructure.

SEMICON India 2026 will continue at Yashobhoomi, New Delhi, until September 19. The event features participation from 52 countries, more than 400 executives and over 150 speakers. It includes six country pavilions representing Japan, South Korea, Malaysia, the Netherlands, Singapore and Sweden, along with 12 state booths, a Startup Pavilion, Innovation Showcase, Student Hackathon and Workforce Development Pavilion.

The Day 2 announcements collectively underline the expanding breadth of India’s semiconductor ambitions—from manufacturing and materials to logistics, indigenous chip products, advanced packaging, power electronics, skills and global partnerships.

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